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Soft Electronic Materials and Devices Enabled by Additive Manufacturing


Materials & Manufacturing, RX/Soft Matter Materials

RO# Location
13.25.04.C0097 Wright-Patterson AFB, OH 454337817


name email phone
Dan Berrigan 609.923.3417


Additive manufacturing offers an opportunity to intimately blend structural design with electronic function.[1,2] The primary focus of our research is to develop materials, processing and modeling tools that allow us to create soft, electronic devices in geometries specifically enabled by additive manufacturing techniques. Of particular interest are flexible materials for sensing, actuation, and embedded power compatible with 3D direct write extrusion and do not introduce rigid components into the design. Extensive additive manufacturing facilities, materials characterization, and finite-element numerical modeling capabilities are available in-house for hands-on experimental and model-based development. Opportunities exist for a postdoctoral applicant interested in the design and manufacturing of soft electronic components.

[1] Valentine, A. D., T. A. Busbee, J. W. Boley, J. R. Raney, A. Chortos, A. Kotikian, J. D. Berrigan, M. F. Durstock, and J. A. Lewis. 2017. “Hybrid 3D Printing of Soft Electronics.” Advanced Materials.

[2] ladman, A. S., E. A. Matsumoto, R. G. Nuzzo, L. Mahadevan, and J. A. Lewis. 2016. “Biomimetic 4D Printing.” Nature Materials 15: 413-419.

additive manufacturing; soft robotics; biomimetics; flexible; electronics; 3D printing; bioinspired; hierarchical; self-assembly


Citizenship:  Open to U.S. citizens
Level:  Open to Postdoctoral and Senior applicants


Base Stipend Travel Allotment Supplementation
$76,542.00 $4,000.00

$3,000 Supplement for Doctorates in Engineering & Computer Science

Experience Supplement:
Postdoctoral and Senior Associates will receive an appropriately higher stipend based on the number of years of experience past their PhD.

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