|Potrepka, Daniel M.
Opportunities exist when funds permit within the area of piezoelectric MEMS technology. Material research may focus on Si wafer processing technologies, lead zirconate titanate (PZT) growth and related seed layer templates development, alternative piezoelectric materials, three-dimensional fabrication and processing, and integrated wafer-level packaging. Device development can include device-specific fabrication processing; design and development of piezoelectric actuators and sensors; and design, testing, and characterization of devices for compact radar, tactical radios, and mm-scale robotics.
This program currently emphasizes development and use of materials and devices with high piezoelectric response and maximum effect for minimum feature size and device footprint to meet power and size constraints. Facilities include device modeling and design, world-class state-of-the-art clean room fabrication technology including sputtering for materials development and fabrication, wet solution chemistry deposition, atomic layer deposition of metals and oxides, electron beam evaporation, precision plasma etching, ion milling, wafer-level bonding, and electron beam and UV photoprocessing. Characterization tools include x-ray diffraction; automated ferroelectric capacitance, loss tangent, leakage current, and polarization testing using probe station; field emission SEM with in-lens, electron backscatter, and software controlled image enhancement; laser doppler vibrometer; three dimensional confocal laser microscopy; and spectroscopic ellipsometry. The facility supports 100 mm and 150 mm wafer fabrication.
PiezoMEMS; MEMS; Thin-film material synthesis; Lead zirconate titanate; Fabrication; Microswitch; Nanoswitch; Microflight; Clean room technology;