Manufacturing optimized devices that incorporate newly-emerging electronic materials (e.g. 2D materials, quantum, semiconductors) requires predictable performance throughout device lifetimes. Unexpected degradation in device performance, sometimes leading to failure, is often traceable to poor material reliability. Reliability is rooted in the stability of the atoms making up a material, and is determined by geometry, microstructure, chemistry, dimensional scale, proximity to other materials, and exposure to external stressors. Integration of powerful characterization techniques and reliability tests of materials under operational conditions improves fundamental understanding and accelerates development of highly-reliable materials and devices. Applicants should have an interest in understanding electrical, thermal or mechanical properties of materials and their defects. A diverse set of backgrounds from materials scientists to electronics engineers are encouraged to apply, as this project is highly multi-disciplinary.